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Harwin launches SYCAMORE Contact; ultra-reliable, durable SMT contact for high volume automated assembly
Introducing the SYCAMORE Contact surface-mount socket from Harwin which provides superior pin retention and durability for high-volume applications manufactured using advanced automated systems.
Introducing DF52 Series, 0.8mm Pitch, Robust, Wire-to-Board Connectors from Hirose, samples available from Anglia
Hirose has introduced the DF52 series to deliver a space-saving, robust, wire-to-board connectivity solution for applications requiring more strength and durability.
Analog Devices Ultralow Power Accelerometer Enables Remote IoT Edge Nodes to Monitor Assets
With its extremely low power capabilities, the ADXL372 micropower high-g MEMS accelerometer targets IoT solutions where shock and impact on a unit during storage, transit, or use would adversely affect its function, safety, or reliability.
Introducing the Renesas Synergy™ range of Embedded Microcontrollers with complete Software Platform
The Renesas Synergy™ Platform is a complete and qualified embedded hardware and software platform that accelerates development, inspiring innovation and enabling differentiation.
Introducing the UMAC Miniature High Capacity Energy Device from Murata
Murata has released the UMAC, a miniature device with a high energy storage capacity. The device has been developed to meet growing demand for compactness, large capacity, extended cycle life, low internal resistance and fast charging and discharging.
Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox & Evaluation Kit
The Enterprise Cloud Toolbox saves embedded developers weeks or even months to create a secure end-to-end Internet of Things (IoT) application for monitoring and controlling the surrounding environment in home, building, or industrial automation systems.
Anglia introduce the DF58 Series Low Profile, 1.2mm Pitch Wire-to-Board Connectors from HIROSE
HIROSE has introduced the DF58 series to deliver a space-saving, low profile, wire-to-board connectivity solution for miniature applications.
Phoenix Contact launch UCS series of versatile Electronics housings for embedded systems
Phoenix Contact has launched a new family of electronics housings, the Universal Case System UCS series offers developers an extremely versatile housing solution which has been specially designed for embedded systems.
Getting started with a cloud-based application using Renesas Synergy
During October, Anglia, in conjunction with Renesas are providing a free one-day seminar and interactive workshop demonstrating the IoT cloud-based application development using Renesas Synergy.
Analog Devices introduces the AD9172 series D/A converter that sets new performance benchmark for Wideband SDR
Analog Devices has introduced a 28-nanometer D/A converter as part of a new series of high speed digital-to-analog converters (D/A converters).
Introducing the Industrial MEMS Sensor Sample Kit from STMicroelectronics
STMicroelectronics have launched the STEVAL-MKIT02V1 MEMS sensors' sample kit for industrial applications which includes 4 different MEMS sensor adapter boards to help designers easily evaluate and speed up time to market.
Omron expands the D6T series of Super-Sensitive Non-Contact MEMS Thermal Sensors
Omron has extended its non-contact MEMS thermal sensor range with the addition of a narrow-field version specifically designed to provide accurate non-contact measurements of objects' temperature for industrial control and building automation systems.
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